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502250-8037 - Molex

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502250-8037 - Molex  - 3D model
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502250-8037 Details

  • Manufacturer Part Number:

    502250-8037

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Unknown

  • Manufacturer:

    Molex

  • Body Breadth:

    0.035 inch

  • Body Depth:

    0.139 inch

  • Body Length:

    0.508 inch

  • Connector Type:

    CARD EDGE CONNECTOR

  • Contact Finish Mating:

    AU ON NI

  • Contact Pattern:

    STAGGERED

  • Contact Resistance:

    80 mΩ

  • Contact Style:

    BELLOWED TYPE

  • Dielectric Withstanding Voltage:

    250VAC V

  • Insulation Resistance:

    50000000 Ω

  • Insulator Color:

    BLACK

  • Insulator Material:

    GLASS FILLED LIQUID CRYSTAL POLYMER

  • Manufacturer Series:

    502250

  • Mating Contact Pitch:

    0.024 inch

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number Of PCB Rows:

    2

  • Number of Rows Loaded:

    2

  • PCB Contact Pattern:

    STAGGERED

  • PCB Contact Row Spacing:

    2.8702 mm

  • Plating Thickness:

    4u inch

  • Rated Current (Signal):

    0.2 A

  • Reference Standard:

    UL

  • Reliability:

    COMMERCIAL

  • Subcategory:

    Headers and Edge Type Connectors

  • Terminal Pitch:

    0.6096 mm

  • Termination Type:

    SURFACE MOUNT

  • Total Number of Contacts:

    37

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502250-8037 Overview

Use the download button to access the 502250-8037 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 50225, or try a keyword search, such as Headers and Edge Type Connectors

About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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