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54132-3333 - Molex

Description: MOLEX - 54132-3333 - CONNECTOR, FFC/FPC, 33POS, 1ROW, 0.5MM

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PCB Footprints
54132-3333 - Molex PCB footprint - Other - Other - 54132-3333-1
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3D Models
54132-3333 - Molex  - 3D model - Other - 54132-3333-1
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54132-3333 Details

  • Manufacturer Part Number:

    54132-3333

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Manufacturer:

    Molex

  • Board Mounting Option:

    FITTING NAIL

  • Body Breadth:

    0.079 inch

  • Body Depth:

    0.22 inch

  • Body Length:

    0.866 inch

  • Connector Type:

    CARD EDGE CONNECTOR

  • Contact Material:

    PHOSPHOR BRONZE

  • Contact Pattern:

    RECTANGULAR

  • Contact Resistance:

    20 mΩ

  • Contact Style:

    BELLOWED TYPE

  • Dielectric Withstanding Voltage:

    250VAC V

  • Durability:

    10 Cycles

  • Insertion Force-Max:

    ZIF N

  • Insulation Resistance:

    50000000 Ω

  • Insulator Color:

    NATURAL

  • Insulator Material:

    GLASS FILLED POLYAMIDE

  • Manufacturer Series:

    54132

  • Mating Contact Pitch:

    0.02 inch

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number Of PCB Rows:

    1

  • Number of Rows Loaded:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PCB Contact Pattern:

    RECTANGULAR

  • Plating Thickness:

    39u inch

  • Rated Current (Signal):

    0.5 A

  • Reference Standard:

    UL

  • Reliability:

    COMMERCIAL

  • Subcategory:

    Headers and Edge Type Connectors

  • Terminal Pitch:

    0.508 mm

  • Termination Type:

    SURFACE MOUNT

  • Total Number of Contacts:

    33

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54132-3333 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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