545BBC156M250ABG footprint, schematic symbol and 3D model by Skyworks

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545BBC156M250ABG Details

Manufacturer Part Number:
545BBC156M250ABG
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Manufacturer:
Skyworks Solutions Inc
YTEOL:
0
Additional Feature:
TRI-STATE; E/D FUNCTION; 1.8 2.5V SUPPLY VOLTAGE ALSO AVAILABLE; DIFFERENTIAL OUTPUT; TAPE
Fall Time-Max:
0.35 ns
Frequency Adjustment-Mechanical:
NO
Frequency Stability:
10%
JESD-609 Code:
e4
Mounting Feature:
SURFACE MOUNT
Number of Terminals:
6
Operating Frequency-Nom:
156.25 MHz
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Oscillator Type:
LVDS
Output Load:
100 OHM
Package Body Material:
METAL
Physical Dimension:
7.0mm x 5.0mm x 1.43mm
Rise Time-Max:
0.35 ns
Supply Voltage-Max:
3.465 V
Supply Voltage-Min:
3.135 V
Supply Voltage-Nom:
3.3 V
Surface Mount:
YES
Symmetry-Max:
55/45 %
Terminal Finish:
NICKEL GOLD

The recommended PCB layout and land pattern can be found in the Skyworks Solutions Inc. application note AN-2009, which provides guidelines for designing a PCB layout that minimizes parasitic inductance and ensures optimal performance of the 545BBC156M250ABG.
The 545BBC156M250ABG has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, the device should be mounted on a heat sink or a metal core PCB to further improve thermal management.
The 545BBC156M250ABG is rated for operation from -40°C to +125°C, but the maximum junction temperature (Tj) should not exceed 150°C to ensure reliable operation and prevent thermal damage.
The 545BBC156M250ABG requires a specific biasing scheme and configuration to operate optimally. Refer to the Skyworks Solutions Inc. application note AN-2008 for detailed information on biasing and configuration guidelines.
The 545BBC156M250ABG should be soldered using a reflow soldering process with a peak temperature of 260°C. Refer to the Skyworks Solutions Inc. application note AN-2010 for detailed information on soldering and assembly procedures.

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