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54944-2070 - Molex

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54944-2070 - Molex  - 3D model
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54944-2070 Details

  • Manufacturer Part Number:

    54944-2070

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LEAD FREE

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Manufacturer:

    Molex

  • YTEOL:

    0

  • Additional Feature:

    ROHS AND ELV COMPLIANT

  • Board Mounting Option:

    PEG

  • Body Breadth:

    0.138 inch

  • Body Depth:

    0.516 inch

  • Body Length:

    0.301 inch

  • Body/Shell Style:

    RECEPTACLE

  • Connector Type:

    TELECOM AND DATACOM CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Gender:

    FEMALE

  • Contact Material:

    NOT SPECIFIED

  • Contact Resistance:

    50 mΩ

  • Contact Style:

    USB, SER B SQ

  • DIN Conformance:

    NO

  • Dielectric Withstanding Voltage:

    200VAC V

  • Durability:

    5000 Cycles

  • Empty Shell:

    NO

  • Filter Feature:

    NO

  • IEC Conformance:

    NO

  • Insulation Resistance:

    1000000000 Ω

  • Insulator Material:

    GLASS FILLED PLASTIC

  • MIL Conformance:

    NO

  • Mating Information:

    MULTIPLE MATING PARTS AVAILABLE

  • Mixed Contacts:

    YES

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    2

  • Operating Temperature-Max:

    60 °C

  • Operating Temperature-Min:

    -20 °C

  • Option:

    GENERAL PURPOSE

  • PCB Contact Pattern:

    STAGGERED

  • PCB Contact Row Spacing:

    1.5494 mm

  • Plating Thickness:

    4u inch

  • Polarization Key:

    POLARIZED HOUSING

  • Rated Current (Signal):

    0.5 A

  • Reference Standard:

    UL

  • Shell Finish:

    GOLD

  • Shell Material:

    STAINLESS STEEL

  • Terminal Pitch:

    0.508 mm

  • Termination Type:

    SURFACE MOUNT

  • Total Number of Contacts:

    20

  • UL Flammability Code:

    94V-0

54944-2070 Frequently Asked Questions (FAQs)

  • The recommended torque for the screw terminals is 0.5-1.5 Nm (4.4-13.3 in-lbs). It's essential to follow this torque specification to ensure reliable connections and prevent damage to the connector.
  • Yes, the 54944-2070 connector is designed to withstand vibrations and can be used in high-vibration applications. However, it's crucial to ensure proper mounting and secure the connector to prevent damage or disconnection.
  • The 54944-2070 connector has a IP67 rating, which means it's protected against dust and water ingress. However, it's essential to follow proper sealing and installation procedures to maintain the IP67 rating. Additionally, the connector's materials and construction can withstand some environmental stress, but it's not designed for extreme outdoor or harsh environmental use.
  • While the datasheet recommends AWG 20-24 wire sizes, it's possible to use other wire sizes with the 54944-2070 connector. However, it's essential to ensure the wire size and insulation meet the connector's specifications and that the connection is reliable and secure. Consult with Molex or a qualified engineer for guidance on using non-recommended wire sizes.
  • The 54944-2070 connector has an operating temperature range of -40°C to 105°C (-40°F to 221°F). It's essential to ensure the connector is used within this temperature range to maintain its performance and reliability.

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54944-2070 Overview

Use the download button to access the 54944-2070 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 54944, or try a keyword search, such as Telecom and Datacom Connectors

About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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