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553SCMGI8 - Renesas Electronics

Description: The 553S is a low skew, single input to four output, LVCMOS clock buffer. The 553S has best in class additive phase Jitter of sub 50 fsec. 

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PCB Footprints
553SCMGI8 - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - 2.0 × 2.0 × 0.5 mm, 8-DFN
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3D Models
553SCMGI8 - Renesas Electronics  - 3D model - Small Outline No-lead - 2.0 × 2.0 × 0.5 mm, 8-DFN
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553SCMGI8 Details

  • Manufacturer Part Number:

    553SCMGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    COL

  • Pin Count:

    8

  • Manufacturer Package Code:

    CMG8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Family:

    553

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    4 ns

  • Same Edge Skew-Max (tskwd):

    0.065 ns

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

553SCMGI8 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow management. Ensure that the device is operated within the recommended temperature range and consider using thermal monitoring and shutdown mechanisms.
  • Use 0.1uF to 1uF decoupling capacitors with a voltage rating of 10V or higher, placed as close as possible to the power pins. Additional capacitors can be placed near the output pins to filter noise.
  • Use a multi-layer PCB with a solid ground plane, and ensure that high-frequency signals are routed away from sensitive analog circuits. Implement EMI filters, such as ferrite beads or common-mode chokes, on the input and output lines.
  • Use a pi-filter (R-C-R) or a T-filter (L-C-R) configuration for input filtering, and a simple RC filter for output filtering. The component values will depend on the specific application and frequency requirements.

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553SCMGI8 Overview

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