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557GI-06LF - Renesas Electronics

Description: The 557-06 is a two to four differential clock mux designed for use in PCI-Express applications. The device selects one of the two differential HCSL input pairs and fans out to four pairs of differential HCSL or LVDS outputs.

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557GI-06LF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG20_a-ren1
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557GI-06LF Details

  • Manufacturer Part Number:

    557GI-06LF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TSSOP

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    3

  • Family:

    557

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    200 MHz

557GI-06LF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • The power-up sequence is critical for the 557GI-06LF. Renesas recommends a specific power-up sequence, which involves powering up the VCC pin first, followed by the VDD pin, and then the input signals. This sequence helps prevent latch-up and ensures proper device operation.
  • Renesas recommends implementing EMI and ESD protection measures, such as using TVS diodes, ferrite beads, and capacitors, to ensure the device operates reliably in noisy environments. Additionally, following proper PCB design and layout guidelines can help minimize EMI and ESD issues.
  • Renesas provides a troubleshooting guide in their documentation, which includes steps to identify and resolve common issues. This may involve checking the power supply, signal integrity, and PCB layout, as well as using debugging tools and techniques to isolate the problem.
  • Renesas recommends implementing thermal management techniques, such as heat sinks, thermal interfaces, and airflow management, to ensure the device operates within its specified temperature range. This is particularly important in high-temperature applications, where the device may be exposed to elevated temperatures.

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557GI-06LF Overview

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Part Image ICS557GI-06LF Integrated Device Technology Inc

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Part Image 557GI-06LFT Integrated Device Technology Inc

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