Description:Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 3 AMP | Contact Base Material Beryllium Copper | Contact Mating Area Plating Material Thickness 30 MICM | Contact Spring Plating Material Tin | Contact Spring Plating Thickness 30 MICIN | Dimensions: Wire Size 27 – 2
Use the download button to access the 5645947-1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 56459,
or try a keyword search, such as Terminals and Terminal Blocks
About TE Connectivity
TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.
