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570BLFT - Renesas Electronics

Description: The IDT570 is a high-performance Zero Delay Buffer (ZDB) which integrates IDT's proprietary analog/digital Phase Locked Loop (PLL) techniques. The A version is recommended for 5 V designs and the B version for 3.3 V designs. The chip is part of IDT's ClockBlocks™ family, and was designed as a performance upgrade to meet today's higher speed and lower voltage requirements. The zero delay feature means that the rising edge of the input clock aligns with the rising edges of both output clocks, giving the appea

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570BLFT - Renesas Electronics - PCB symbol
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570BLFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8
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570BLFT - Renesas Electronics - 3D model - Small Outline Packages - SOIC-8
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570BLFT Details

  • Manufacturer Part Number:

    570BLFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    DCG8

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    570

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.175 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    170 MHz

570BLFT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow management. Ensure that the device is operated within the recommended temperature range and consider using thermal monitoring and shutdown mechanisms.
  • Use a metal shield or a conductive enclosure to minimize EMI and RFI emissions. Ensure that the PCB layout is designed to minimize radiation and that all cables and connectors are properly shielded.
  • Implement power-saving modes, reduce clock frequencies, and optimize software algorithms to minimize power consumption. Consider using dynamic voltage and frequency scaling to reduce power consumption and heat generation.
  • Use 0.1uF to 1uF decoupling capacitors with a voltage rating of 10V to 25V, placed as close as possible to the power pins. Ensure that the capacitors are connected between the power pins and the ground plane.

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570BLFT Overview

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570BLFT Alternates

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Part Image 570BLFT Integrated Device Technology Inc

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