591BD200M000DG footprint, schematic symbol and 3D model by Skyworks

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591BD200M000DG Details

Manufacturer Part Number:
591BD200M000DG
Rohs Code:
Yes
Part Life Cycle Code:
Active
Manufacturer:
Skyworks Solutions Inc
YTEOL:
6
Additional Feature:
TRI-STATE; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TAPE
Fall Time-Max:
0.35 ns
Frequency Adjustment-Mechanical:
NO
Frequency Stability:
7%
JESD-609 Code:
e4
Mounting Feature:
SURFACE MOUNT
Number of Terminals:
4
Operating Frequency-Nom:
200 MHz
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Oscillator Type:
LVDS
Output Load:
100 OHM
Package Body Material:
METAL
Physical Dimension:
7.0mm x 5.0mm x 1.8mm
Rise Time-Max:
0.35 ns
Supply Voltage-Max:
3.63 V
Supply Voltage-Min:
2.97 V
Supply Voltage-Nom:
3.3 V
Surface Mount:
YES
Symmetry-Max:
55/45 %
Terminal Finish:
GOLD OVER NICKEL

The recommended PCB layout and land pattern can be found in the Skyworks Solutions Inc. application note AN-2002, which provides guidelines for designing a PCB layout that minimizes parasitic inductance and ensures optimal performance of the 591BD200M000DG.
The 591BD200M000DG has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, the device should be mounted on a heat sink or a metal core PCB to further improve thermal management.
The 591BD200M000DG is rated for operation from -40°C to +125°C, but the maximum junction temperature (Tj) should not exceed 150°C to ensure reliable operation and prevent damage to the device.
The 591BD200M000DG requires a specific biasing scheme to operate optimally. The recommended biasing scheme can be found in the datasheet, and it is essential to follow the recommended voltage and current levels to ensure the device operates within its specifications.
The 591BD200M000DG is a sensitive device and requires proper ESD protection during handling and assembly. It is recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and to ensure that the device is stored in an ESD-safe environment.

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