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593D686X9010D2TE3 - Vishay

Description: Solid Tantalum Surface Mount Chip Capacitors TANTAMOUNT(TM), Molded Case, Low ESR

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593D686X9010D2TE3 - Vishay PCB footprint - Capacitor Moulded Polarised - Capacitor Moulded Polarised - Case Code D
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593D686X9010D2TE3 - Vishay  - 3D model - Capacitor Moulded Polarised - Case Code D
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593D686X9010D2TE3 Details

  • Manufacturer Part Number:

    593D686X9010D2TE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Israel, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.98

  • Additional Feature:

    ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ

  • Capacitance:

    68 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (DRY/SOLID)

  • ESR:

    150 mΩ

  • Height:

    2.8 mm

  • JESD-609 Code:

    e3

  • Leakage Current:

    0.0068 mA

  • Length:

    7.3 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    10 V

  • Ripple Current:

    400 mA

  • Size Code:

    2917

  • Surface Mount:

    YES

  • Tan Delta:

    0.06

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    J BEND

  • Width:

    4.3 mm

593D686X9010D2TE3 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 593D686X9010D2TE3 can be found in the Vishay Intertechnologies' recommended land pattern document, which provides detailed information on the pad layout and dimensions for optimal assembly and reliability.
  • The 593D686X9010D2TE3 is a moisture-sensitive device and should be handled according to the JEDEC J-STD-033 standard. This includes baking the devices before reflow soldering and using a nitrogen-filled packaging to prevent moisture absorption.
  • The maximum reflow temperature for the 593D686X9010D2TE3 is 260°C, as specified in the datasheet. Exceeding this temperature may cause damage to the device.
  • The 593D686X9010D2TE3 is designed to withstand moderate vibration levels, but it's essential to evaluate the device's performance in your specific application. You may need to perform additional testing and analysis to ensure the device meets your requirements.
  • To determine the power rating of the 593D686X9010D2TE3 in your application, you need to consider factors such as the operating voltage, current, and ambient temperature. You can use the datasheet's power derating curves and thermal resistance data to estimate the device's power rating in your specific use case.

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593D686X9010D2TE3 Overview

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Part Image T496D686K010CC642A7640 KEMET Corporation

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For a full list of alternate parts for 593D686X9010D2TE3, check out Findchips.com