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5962-0051401VPA - Texas Instruments

Description: UC1708-SP NON-INVERTING HIGH SPE

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5962-0051401VPA - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8
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5962-0051401VPA - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8
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5962-0051401VPA Details

  • Manufacturer Part Number:

    5962-0051401VPA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    3 A

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Qualified

  • Screening Level:

    MIL-PRF-38535 Class V

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    26 mA

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    20 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.055 µs

  • Turn-on Time:

    0.075 µs

  • Width:

    7.62 mm

5962-0051401VPA Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Texas Instruments' guidelines for PCB layout and thermal management. This includes using a multi-layer PCB with a solid ground plane, placing the device near a heat sink or thermal pad, and ensuring good airflow around the device.
  • To ensure EMC and reduce EMI, follow proper PCB design and layout practices, such as using shielding, filtering, and grounding techniques. Additionally, consider using EMI-absorbing materials and following Texas Instruments' guidelines for EMI reduction.
  • The reliability and failure rate of the 5962-0051401VPA are dependent on various factors, including operating conditions, quality of the device, and manufacturing process. According to Texas Instruments' reliability data, the device has a high mean time between failures (MTBF) and a low failure rate. However, it's essential to consult the datasheet and reliability reports for specific information.
  • The 5962-0051401VPA is rated for operation up to 125°C. However, the device's performance and reliability may degrade at higher temperatures. It's essential to consult the datasheet and thermal management guidelines to ensure proper operation and to avoid overheating.
  • The 5962-0051401VPA is not specifically designed for space or high-radiation applications. However, Texas Instruments offers radiation-hardened devices and variants that can withstand high levels of radiation. Consult Texas Instruments' radiation-hardened product portfolio for suitable alternatives.

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5962-0051401VPA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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