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5962-0923301VPA - Texas Instruments

Description: Space-grade QMLV adjustable precision analog controller

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5962-0923301VPA - Texas Instruments - PCB symbol
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PCB Footprints
5962-0923301VPA - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8)-*
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3D Models
5962-0923301VPA - Texas Instruments - 3D model - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8)-*
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5962-0923301VPA Details

  • Manufacturer Part Number:

    5962-0923301VPA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-CDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Qualified

  • Screening Level:

    MIL-STD-883 Class V

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max (Isup):

    0.8 mA

  • Supply Voltage-Max (Vsup):

    24 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Total Dose:

    30k Rad(Si) V

  • Width:

    7.62 mm

5962-0923301VPA Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management strategy in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, reduce thermal resistance, and prevent overheating.
  • To ensure EMC and reduce EMI, follow Texas Instruments' guidelines for PCB layout, component placement, and shielding. Additionally, consider using EMI filters, shielding cans, and proper grounding techniques to minimize radiation and susceptibility.
  • Texas Instruments provides reliability data and failure rate expectations in their datasheets and reliability reports. For high-reliability applications, it's essential to consult these resources and consider additional testing and qualification procedures to ensure the device meets the required standards.
  • The 5962-0923301VPA is not specifically designed for radiation-hardened or high-temperature environments. However, Texas Instruments offers other devices that are designed for these applications. Consult their product portfolio and datasheets to find a suitable replacement or alternative solution.
  • Texas Instruments provides recommended soldering and assembly techniques in their datasheets and application notes. It's essential to follow these guidelines to prevent damage during assembly and ensure reliable operation.

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5962-0923301VPA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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