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5962-8670402PA - Texas Instruments

Description: Switching Controllers Current Mode PWM Controller 8-CDIP -55 to 125

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5962-8670402PA - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8)_a
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5962-8670402PA Details

  • Manufacturer Part Number:

    5962-8670402PA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    8.2 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    30 V

  • Supply Voltage-Min (Vsup):

    8.5 V

  • Surface Mount:

    NO

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    500 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

5962-8670402PA Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Texas Instruments' guidelines for PCB layout and thermal management. This includes using a multi-layer PCB with a solid ground plane, placing the device near a heat sink or thermal pad, and ensuring good airflow around the device.
  • To ensure EMC and reduce EMI, follow proper PCB design and layout practices, such as using shielding, filtering, and grounding techniques. Additionally, consider using EMI-absorbing materials and following Texas Instruments' guidelines for EMI reduction.
  • Texas Instruments provides reliability data and failure rate expectations in their documentation. For high-reliability applications, it's recommended to consult with Texas Instruments' reliability engineers and follow their guidelines for reliability testing and qualification.
  • The 5962-8670402PA is not specifically designed for radiation-hardened or high-temperature environments. However, Texas Instruments offers other devices that are designed for these applications. Consult with Texas Instruments' sales team or application engineers to determine the best device for your specific requirements.
  • Texas Instruments provides testing and validation procedures in their documentation. It's recommended to follow these procedures and consult with Texas Instruments' application engineers to ensure proper testing and validation of the device.

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5962-8670402PA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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For a full list of alternate parts for 5962-8670402PA, check out Findchips.com