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5962-8670405VPA - Texas Instruments

Description: https://www.ti.com/lit/ds/symlink/uc1842a-sp.pdf?ts=1630915801853&ref_url=https%253A%252F%252Fwww.ti.com%252Fstore%252Fti%252Fen%252Fp%252Fproduct%252F%253Fp%253D5962-8670405VPA

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5962-8670405VPA - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8
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5962-8670405VPA - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8
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5962-8670405VPA Details

  • Manufacturer Part Number:

    5962-8670405VPA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    11 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Qualified

  • Screening Level:

    MIL-PRF-38535 Class V

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    25 V

  • Supply Voltage-Min (Vsup):

    12 V

  • Surface Mount:

    NO

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    500 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

5962-8670405VPA Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern around the device to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider using thermal interface materials (TIMs) to reduce thermal resistance. Additionally, ensure that the device is not exposed to temperatures above the recommended maximum junction temperature (Tj) of 150°C.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device reliability, increased thermal resistance, and potentially cause permanent damage to the device. It's essential to ensure that the device operates within the recommended temperature range to maintain its performance and lifespan.
  • To prevent electrostatic discharge (ESD) damage, it's recommended to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design. The 5962-8670405VPA has an internal ESD protection diode, but additional external protection may be necessary depending on the application.
  • To ensure proper startup and operation, it's essential to follow the recommended power sequencing and startup procedures. This includes ensuring that the input voltage (VIN) is applied before the enable signal (EN), and that the device is properly biased during startup. Refer to the datasheet for specific guidelines.

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5962-8670405VPA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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