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5962-8670408VPA - Texas Instruments

Description: Space-grade, 30-V, 1-A, 500-kHz current mode PWM controller with 8.4-V/7.6-V UVLO 50% duty cycle

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5962-8670408VPA - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8).-4
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5962-8670408VPA - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8).-4
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5962-8670408VPA Details

  • Manufacturer Part Number:

    5962-8670408VPA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    12 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    5.06 V

  • Output Voltage-Min:

    4.95 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Qualified

  • Screening Level:

    MIL-PRF-38535 Class V

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    25 V

  • Supply Voltage-Min (Vsup):

    12 V

  • Surface Mount:

    NO

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    500 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Total Dose:

    30k Rad(Si) V

  • Width:

    7.62 mm

5962-8670408VPA Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it's recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the device to dissipate heat efficiently.
  • To ensure signal integrity, use controlled impedance traces, add series termination resistors, and consider using a signal integrity model to simulate and optimize your design.
  • The 5962-8670408VPA requires a specific power sequencing order to prevent damage. Ensure that the core voltage (VCC) is powered up before the input/output voltage (VCCIO).
  • To minimize EMI, use a multi-layer PCB, add EMI filters, and consider using shielding or a Faraday cage to contain electromagnetic radiation.
  • Consider the device's thermal resistance, junction temperature, and power dissipation when designing your thermal management system. Use thermal simulation tools to optimize your design.

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5962-8670408VPA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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