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5962-8768105VEA - Texas Instruments

Description: UC1825A-SP HIGH SPEED PWM CONTRO

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5962-8768105VEA - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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5962-8768105VEA - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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5962-8768105VEA Details

  • Manufacturer Part Number:

    5962-8768105VEA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN CURRENT MODE

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    10 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.56 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2.2 A

  • Output Voltage-Max:

    5.15 V

  • Output Voltage-Min:

    5.05 V

  • Output Voltage-Nom:

    5.1 V

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Qualified

  • Screening Level:

    MIL-PRF-38535 Class V

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max (Isup):

    36 mA

  • Supply Voltage-Max (Vsup):

    30 V

  • Supply Voltage-Min (Vsup):

    10 V

  • Surface Mount:

    NO

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Total Dose:

    30k Rad(Si) V

  • Width:

    7.62 mm

5962-8768105VEA Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (–40°C to 125°C) and consider the device's power dissipation, thermal resistance, and junction temperature. Proper heat sinking, airflow, and thermal management are crucial.
  • The input capacitor should have a minimum capacitance of 10uF, with a voltage rating of at least 6.3V. The output capacitor should have a minimum capacitance of 22uF, with a voltage rating of at least 6.3V. X5R or X7R ceramic capacitors are recommended for their low ESR and high reliability.
  • To troubleshoot output voltage regulation issues, check the input voltage, output load, and feedback resistors. Ensure the input voltage is within the recommended range, the output load is within the specified current limit, and the feedback resistors are correctly configured. Also, verify that the device is properly soldered and the PCB layout is correct.
  • Operating the device at the maximum rated current can lead to increased power dissipation, junction temperature, and reduced reliability. It's essential to consider the device's thermal resistance, power dissipation, and junction temperature to ensure reliable operation. De-rating the current or using a heat sink may be necessary to ensure reliable operation.

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5962-8768105VEA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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