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5962-9457201MEA - Analog Devices

Description: Dual, Low Noise, Wideband Variable Gain Amplifier, 0 dB To +40 dB Gain

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5962-9457201MEA - Analog Devices - PCB symbol
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5962-9457201MEA - Analog Devices PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - Q-16_2023
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5962-9457201MEA Details

  • Manufacturer Part Number:

    5962-9457201MEA

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    CERDIP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    Q-16

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.05 mm

  • Neg Supply Voltage-Max (Vsup):

    -5.25 V

  • Neg Supply Voltage-Min (Vsup):

    -4.75 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

5962-9457201MEA Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Analog Devices' PCB layout guidelines, which include keeping the device away from high-current carrying traces, using a solid ground plane, and providing adequate thermal relief. Additionally, a thermal pad on the bottom of the package can help dissipate heat.
  • To ensure EMC, follow proper PCB design and layout practices, such as using a shielded enclosure, minimizing loop areas, and using filtering components. Additionally, Analog Devices provides EMC guidelines and application notes that can be consulted for specific guidance.
  • Analog Devices provides reliability data and failure rate estimates for their devices, which can be found in the device's reliability report or by contacting their technical support. The 5962-9457201MEA is a high-reliability device, but it's essential to consult the specific reliability data for your application.
  • The 5962-9457201MEA is not specifically designed for radiation-hardened or high-temperature environments. However, Analog Devices offers other devices that are designed for these applications. Consult their product portfolio or contact their technical support for guidance on selecting the appropriate device.
  • Analog Devices provides guidelines for soldering and assembly, including recommended soldering temperatures, times, and techniques. It's essential to follow these guidelines to ensure the device's reliability and performance.

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5962-9457201MEA Overview

Use the download button to access the 5962-9457201MEA schematic symbol and PCB footprint.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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