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5962-9555001NXDR - Texas Instruments

Description: Quad, Micropower, LinCMOS™ Comparator

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5962-9555001NXDR - Texas Instruments - PCB symbol
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PCB Footprints
5962-9555001NXDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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3D Models
5962-9555001NXDR - Texas Instruments - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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5962-9555001NXDR Details

  • Manufacturer Part Number:

    5962-9555001NXDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.03 µA

  • Bias Current-Max (IIB) @25C:

    0.00003 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Type:

    OPEN-COLLECTOR; OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    2500 ns

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    1.75 mm

  • Subcategory:

    Comparator

  • Supply Current-Max:

    0.08 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

5962-9555001NXDR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (–40°C to 125°C) and consider thermal management techniques such as heat sinks, thermal interfaces, and airflow.
  • Exceeding the maximum junction temperature (TJ) rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It's crucial to ensure the device operates within the recommended temperature range to maintain reliability and performance.
  • To prevent electrostatic discharge (ESD) damage, handle the device with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the device is properly grounded during assembly, and consider using ESD-protective packaging and storage materials.
  • Texas Instruments recommends soldering the device using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Hand soldering is not recommended due to the risk of overheating the device.

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5962-9555001NXDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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