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5962-9855501VPA - Texas Instruments

Description: Timers & Support Products Not available Through Mouser

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5962-9855501VPA - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8
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5962-9855501VPA - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8
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5962-9855501VPA Details

  • Manufacturer Part Number:

    5962-9855501VPA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    TIMER

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.6 mm

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Qualified

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max (Isup):

    20 mA

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    6.67 mm

5962-9855501VPA Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Texas Instruments' recommended PCB layout guidelines, including using a solid ground plane, minimizing trace lengths, and using thermal vias to dissipate heat. A thermal management strategy should also be implemented, such as using a heat sink or thermal interface material.
  • To ensure EMC and reduce EMI, follow best practices for PCB layout, such as separating analog and digital circuits, using shielding, and implementing filtering and decoupling techniques. Additionally, consider using EMI-absorbing materials and following Texas Instruments' guidelines for EMI reduction.
  • Operating the device beyond recommended conditions can lead to reduced reliability, increased power consumption, and potential failure. To mitigate risks, ensure that your design operates within the recommended specifications, and consider implementing overvoltage protection, overcurrent protection, and thermal monitoring.
  • To troubleshoot and debug issues, use a systematic approach, checking power supply, clock signals, and data lines. Common pitfalls to avoid include incorrect pin connections, inadequate decoupling, and insufficient thermal management. Consult Texas Instruments' application notes and technical support resources for guidance.
  • In high-reliability or safety-critical applications, consider additional factors such as fault tolerance, redundancy, and fail-safe design. Ensure that your design meets relevant industry standards and regulations, and consult with Texas Instruments' technical support and industry experts to ensure the device is used in a way that meets the required safety and reliability standards.

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5962-9855501VPA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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