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5AGXBA1D4F27C4N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Arria V GX 2830 LABS 336 IOs

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5AGXBA1D4F27C4N - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip – Thermal Composite - A:2.70 - D2: 20.38
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3D Models
5AGXBA1D4F27C4N - Intel  - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip – Thermal Composite - A:2.70 - D2: 20.38
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5AGXBA1D4F27C4N Details

  • Manufacturer Part Number:

    5AGXBA1D4F27C4N

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, FBGA-672

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    670 MHz

  • JESD-30 Code:

    S-PBGA-B672

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2830

  • Number of Inputs:

    416

  • Number of Logic Cells:

    75000

  • Number of Outputs:

    416

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2830 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA672,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.7 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

5AGXBA1D4F27C4N Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 5AGXBA1D4F27C4N FPGA is approximately 12W, but this can vary depending on the specific design and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow the clocking guidelines outlined in the Intel FPGA Clocking and PLL User Guide.
  • To optimize your design for area and performance, use the Intel Quartus Prime software to analyze and optimize your design. This includes using the Design Space Explorer (DSE) to explore different design implementations, and the Performance Analyzer to identify performance bottlenecks.
  • To ensure reliable data transmission over the high-speed transceivers, follow the guidelines outlined in the Intel FPGA High-Speed Transceiver User Guide. This includes using the correct transceiver settings, implementing proper signal termination, and using error correction mechanisms such as 8B/10B encoding.
  • Intel provides a comprehensive PCB design guide that outlines the recommended design guidelines for the 5AGXBA1D4F27C4N FPGA. This includes guidelines for signal integrity, power distribution, and thermal management.

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5AGXBA1D4F27C4N Overview

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Part Image 5AGXBA1D4F27C4 Intel Corporation

Field Programmable Gate Array, 2830 CLBS, 670MHz, PBGA672