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5AGXFA5H4F35I3 - Intel

Description: IC FPGA 544 I/O 1152FBGA

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PCB Footprints
5AGXFA5H4F35I3 - Intel PCB footprint - BGA - BGA - 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Thermal Composite - A:2.70 - D2:22.1
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3D Models
5AGXFA5H4F35I3 - Intel  - 3D model - BGA - 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Thermal Composite - A:2.70 - D2:22.1
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5AGXFA5H4F35I3 Details

  • Manufacturer Part Number:

    5AGXFA5H4F35I3

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-1152

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    670 MHz

  • JESD-30 Code:

    S-PBGA-B1152

  • Length:

    35 mm

  • Number of Inputs:

    544

  • Number of Outputs:

    544

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    7169 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.7 mm

  • Supply Voltage-Max:

    1.18 V

  • Supply Voltage-Min:

    1.12 V

  • Supply Voltage-Nom:

    1.15 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

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5AGXFA5H4F35I3 Overview

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Part Image 5AGXFA5H4F35I3G Intel Corporation

Field Programmable Gate Array, 7170 CLBS, 190000-Cell, TSMC, PBGA1152

Part Image 5AGXFA5H4F35I3 Altera Corporation

Field Programmable Gate Array, 670MHz, PBGA1152

Part Image 5AGXFA5H4F35I3N Altera Corporation

Field Programmable Gate Array, 670MHz, PBGA1152