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5AGXFB3H4F40C5N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Arria V GX 13688 LABs 704 IOs

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5AGXFB3H4F40C5N - Intel PCB footprint - BGA - BGA - 1517-Pin FineLine Ball-Grid Array (FBGA)
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5AGXFB3H4F40C5N - Intel  - 3D model - BGA - 1517-Pin FineLine Ball-Grid Array (FBGA)
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5AGXFB3H4F40C5N Details

  • Manufacturer Part Number:

    5AGXFB3H4F40C5N

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, FBGA-1517

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    622 MHz

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    13688

  • Number of Inputs:

    704

  • Number of Logic Cells:

    362000

  • Number of Outputs:

    704

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    85 °C

  • Organization:

    13688 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1517,39X39,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.7 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    40 mm

5AGXFB3H4F40C5N Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 5AGXFB3H4F40C5N FPGA is approximately 12W, but this can vary depending on the specific application and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow the clocking guidelines outlined in the Intel FPGA Clocking and PLL User Guide.
  • To optimize your design for area and performance, Intel recommends using the Intel Quartus Prime software to analyze and optimize your design. This can include using design space exploration, pipelining, and resource sharing to minimize area and maximize performance.
  • To ensure reliable data transfer between the FPGA and external memory, Intel recommends using a data transfer protocol such as DDR3 or DDR4, and implementing error correction mechanisms such as ECC or CRC. Additionally, it's essential to follow the memory interface guidelines outlined in the Intel FPGA Memory Interface User Guide.
  • The 5AGXFB3H4F40C5N FPGA has a maximum junction temperature of 100°C. To ensure reliable operation, Intel recommends using a heat sink or thermal management system to keep the FPGA within a safe operating temperature range. Additionally, it's essential to follow the thermal management guidelines outlined in the Intel FPGA Thermal Management User Guide.

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5AGXFB3H4F40C5N Overview

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Part Image 5AGXFB3H4F40C5G Intel Corporation

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Part Image 5AGXFB3H4F40I5P Intel Corporation

Field Programmable Gate Array, 362000-Cell, PBGA1517

Part Image 5AGXFB3H4F40C5P Intel Corporation

Field Programmable Gate Array, 362000-Cell, PBGA1517

Part Image 5AGXFB3H4F40I5 Altera Corporation

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Part Image 5AGXFB3H4F40I5 Intel Corporation

Field Programmable Gate Array, 13688 CLBS, 622MHz, 362730-Cell, CMOS, PBGA1517

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