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5AGXFB7H4F35I5N - Intel

Description: Arria V GX Field Programmable Gate Array (FPGA) IC 544 27695104 504000 1152-BBGA, FCBGA Exposed Pad

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5AGXFB7H4F35I5N - Intel - PCB symbol
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PCB Footprints
5AGXFB7H4F35I5N - Intel PCB footprint - BGA - BGA - 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Thermal Composite - A:2.70 - D2:22.1
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3D Models
5AGXFB7H4F35I5N - Intel - 3D model - BGA - 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Thermal Composite - A:2.70 - D2:22.1
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5AGXFB7H4F35I5N Details

  • Manufacturer Part Number:

    5AGXFB7H4F35I5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, FBGA-1152

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    622 MHz

  • JESD-30 Code:

    S-PBGA-B1152

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    19024

  • Number of Inputs:

    704

  • Number of Logic Cells:

    504000

  • Number of Outputs:

    704

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    19024 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.7 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

5AGXFB7H4F35I5N Frequently Asked Questions (FAQs)

  • Intel recommends a 4-6 layer PCB stackup with a minimum of 2 mil trace width and 2 mil spacing. A dedicated power plane and a solid ground plane are also recommended for optimal signal integrity.
  • Use the Intel Power Estimator tool to estimate power consumption based on your design's specific requirements. Optimize power consumption by using low-power modes, clock gating, and dynamic voltage and frequency scaling.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider using a fan. Keep the FPGA away from other heat sources and ensure good thermal conduction paths.
  • Use a reliable configuration device, such as a flash memory or a configuration FPGA. Ensure proper power sequencing, and use a robust boot-up sequence with error detection and correction mechanisms.
  • Use differential signaling, controlled impedance, and matched transmission lines. Minimize signal routing, use signal shielding, and avoid vias and stubs in high-speed signal paths.

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5AGXFB7H4F35I5N Overview

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5AGXFB7H4F35I5N Alternates

Showing results

Image Part Number Model
Part Image 5AGXFB7H4F35I5P Intel Corporation

Field Programmable Gate Array, 504000-Cell, PBGA1152
Part Image 5AGXFB7H4F35I5 Altera Corporation

Field Programmable Gate Array, 622MHz, 503500-Cell, CMOS, PBGA1152
Part Image 5AGXFB7H4F35I5N Altera Corporation

Field Programmable Gate Array, 622MHz, 503500-Cell, CMOS, PBGA1152
Part Image 5AGXFB7H4F35C5 Intel Corporation

Field Programmable Gate Array, 19024 CLBS, 622MHz, 503500-Cell, CMOS, PBGA1152
Part Image 5AGXFB7H4F35C5N Altera Corporation

Field Programmable Gate Array, 504000 CLBs, 503500-Cell, CMOS, PBGA1152
For a full list of alternate parts for 5AGXFB7H4F35I5N, check out Findchips.com