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5AGXMA3D4F27I3N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Arria V GX 5890 LABS 336 IOs

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5AGXMA3D4F27I3N - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip – Thermal Composite - A:2.70 - D2: 20.38
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5AGXMA3D4F27I3N - Intel  - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip – Thermal Composite - A:2.70 - D2: 20.38
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5AGXMA3D4F27I3N Details

  • Manufacturer Part Number:

    5AGXMA3D4F27I3N

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-672

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B672

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    5890

  • Number of Inputs:

    416

  • Number of Logic Cells:

    156000

  • Number of Outputs:

    416

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5890 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA672,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.7 mm

  • Supply Voltage-Max:

    1.18 V

  • Supply Voltage-Min:

    1.12 V

  • Supply Voltage-Nom:

    1.15 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

5AGXMA3D4F27I3N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the Arria 10 GX FPGA family, which includes the 5AGXMA3D4F27I3N. The guide recommends a 4-6 layer PCB stackup with a minimum of two power planes and two ground planes. It also provides guidelines for signal routing, decoupling, and thermal management.
  • Intel provides a Power and Thermal Management Guide for the Arria 10 GX FPGA family. It recommends using the Intel PowerPlay Early Power Estimator (EPE) tool to estimate power consumption and thermal design power (TDP). Additionally, the guide provides guidelines for power supply design, voltage regulation, and thermal management techniques such as heat sinks and thermal interfaces.
  • The 5AGXMA3D4F27I3N FPGA has high-speed transceivers that support up to 17.4 Gbps data rates. However, there are limitations and considerations for using these transceivers, such as signal integrity, channel equalization, and clocking requirements. Intel provides a Transceiver User Guide that provides detailed information on how to design and implement high-speed transceiver interfaces.
  • Intel provides a Secure Boot and Image Protection Guide for the Arria 10 GX FPGA family. The guide recommends using a secure boot mechanism, such as the Intel FPGA Secure Boot solution, to ensure that the FPGA boots securely and reliably. It also provides guidelines for image protection, encryption, and authentication.
  • Intel provides a Debug and Test Guide for the Arria 10 GX FPGA family. The guide recommends using Intel's SignalTap II logic analyzer and the Intel FPGA SDK for SoC to debug and test the FPGA design. It also provides guidelines for signal probing, waveform analysis, and functional verification.

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5AGXMA3D4F27I3N Overview

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Part Image 5AGXMA3D4F27I3 Altera Corporation

Field Programmable Gate Array, 670MHz, PBGA672

Part Image 5AGXMA3D4F27I3 Intel Corporation

Field Programmable Gate Array, 5890 CLBS, 670MHz, PBGA672