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Part Image

5CEBA2F23C7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V E 9434 LABs 224 IOs

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PCB Footprints
5CEBA2F23C7N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00----
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3D Models
5CEBA2F23C7N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00----
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5CEBA2F23C7N Details

  • Manufacturer Part Number:

    5CEBA2F23C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, FBGA-484

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    23 mm

  • Number of Inputs:

    224

  • Number of Logic Cells:

    25000

  • Number of Outputs:

    224

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    23 mm

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5CEBA2F23C7N Overview

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