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5CEFA9F27C8N - Intel

Description: 5CEFA9F27C8N, FPGA Cyclone V 301000 Cells, 14251008bit, 113560 Blocks, 1.07 → 1.13 V 672-Pin FBGA

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5CEFA9F27C8N - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEFA9F27C8N - Intel  - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CEFA9F27C8N Details

  • Manufacturer Part Number:

    5CEFA9F27C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    27 mm

  • Number of Inputs:

    336

  • Number of Logic Cells:

    301000

  • Number of Outputs:

    336

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    11356 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA672,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

5CEFA9F27C8N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide and thermal management guidelines in the 'Intel FPGA PCB Design Guidelines' document, which can be found on their website. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • Intel provides a power estimator tool, 'Early Power Estimator (EPE)', which can help estimate power consumption based on the design's requirements. Additionally, implementing power-saving features like clock gating, dynamic voltage and frequency scaling, and using low-power modes can help reduce power consumption.
  • Intel recommends using the 'Intel FPGA Security' features, such as bitstream encryption, authentication, and secure boot mechanisms. Additionally, implementing secure key management, using secure protocols for configuration and data transfer, and following secure coding practices can help prevent unauthorized access.
  • Intel provides guidelines for signal integrity and EMI mitigation in the 'Intel FPGA Signal Integrity and EMI Design Guidelines' document. Following best practices for PCB layout, using proper termination and filtering, and implementing EMI reduction techniques like spread spectrum clocking can help minimize EMI and ensure signal integrity.
  • Intel recommends following the 'Intel FPGA Testing and Validation' guidelines, which include functional testing, timing closure, and signal integrity testing. Additionally, using Intel's 'Quartus Prime' software and 'ModelSim' simulator can help validate the design and ensure it meets the required specifications.

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5CEFA9F27C8N Overview

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Part Image 5CEFA9F27C8N Altera Corporation

Field Programmable Gate Array, 301000-Cell, CMOS, PBGA672