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5CGTFD7C5F23C7N - Intel

Description: FPGA - Field Programmable Gate Array The factory is currently not accepting orders for this product.

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5CGTFD7C5F23C7N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond -  A:2.00
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5CGTFD7C5F23C7N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond -  A:2.00
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5CGTFD7C5F23C7N Details

  • Manufacturer Part Number:

    5CGTFD7C5F23C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    5648

  • Number of Inputs:

    240

  • Number of Logic Cells:

    150000

  • Number of Outputs:

    240

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    5648 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CGTFD7C5F23C7N Frequently Asked Questions (FAQs)

  • The TDP is typically specified in the datasheet, but if not, it can be obtained from the manufacturer's support team or through a detailed power analysis.
  • The recommended power sequencing scheme can usually be found in the datasheet or application notes. If not, consult with the manufacturer's support team or a qualified engineer.
  • The datasheet or application notes often provide guidelines for PCB layout and routing. If not, consult with the manufacturer's support team or a qualified engineer.
  • Consult the datasheet, application notes, and troubleshooting guides provided by the manufacturer. If still unsure, contact the manufacturer's support team or a qualified engineer.
  • The datasheet or application notes may provide guidance on EMI/EMC considerations. If not, consult with the manufacturer's support team or a qualified engineer.

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5CGTFD7C5F23C7N Overview

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Part Image 5CGTFD7C5F23C7 Intel Corporation

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Part Image 5CGTFD7C5F23I7N Altera Corporation

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Part Image 5CGTFD7C5F23I7 Altera Corporation

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