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5CGTFD7D5F27I7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V GT 5648 LABs 336 IOs

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5CGTFD7D5F27I7N - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CGTFD7D5F27I7N - Intel  - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CGTFD7D5F27I7N Details

  • Manufacturer Part Number:

    5CGTFD7D5F27I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    336

  • Number of Logic Cells:

    149500

  • Number of Outputs:

    336

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5648 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA672,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

5CGTFD7D5F27I7N Frequently Asked Questions (FAQs)

  • The TDP is typically specified in the datasheet, but if it's not, you can contact Intel support or check their website for more information.
  • You can refer to the datasheet and Intel's power management guidelines for the specific part. You may also need to consult with a power management expert or Intel's support team.
  • Intel usually provides PCB layout and routing guidelines in the datasheet or in a separate application note. You can also consult with a PCB design expert or Intel's support team.
  • You can refer to the datasheet, Intel's troubleshooting guides, and online forums. You may also need to contact Intel's support team or a qualified engineer for assistance.
  • You can refer to the datasheet and Intel's software development kits (SDKs) for the specific part. You may also need to consult with a software engineer or Intel's support team.

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5CGTFD7D5F27I7N Overview

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