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5CGXFC7D6F31I7N - Intel

Description: IC FPGA 480 I/O 896FBGA

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PCB Footprints
5CGXFC7D6F31I7N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CGXFC7D6F31I7N Details

  • Manufacturer Part Number:

    5CGXFC7D6F31I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B896

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    5648

  • Number of Inputs:

    480

  • Number of Logic Cells:

    150000

  • Number of Outputs:

    480

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5648 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5CGXFC7D6F31I7N Frequently Asked Questions (FAQs)

  • The 5CGXFC7D6F31I7N FPGA has an operating temperature range of 0°C to 100°C (TJ).
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The FPGA's internal POR circuit can also be used, but it may not be as reliable.
  • Intel provides a PCB layout and routing guide for the 5CGXFC7D6F31I7N FPGA, which includes recommendations for signal integrity, power distribution, and thermal management. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • To optimize power consumption and reduce heat generation, use the Intel Quartus Prime software to optimize the design for power, enable dynamic voltage and frequency scaling, and use the FPGA's built-in power management features, such as the Power Manager IP core.
  • The recommended settings for clock management and PLL configuration can be found in the Intel Quartus Prime software and the 5CGXFC7D6F31I7N FPGA datasheet. It's essential to follow these guidelines to ensure proper clocking and PLL configuration.

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5CGXFC7D6F31I7N Overview

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Image Part Number Model
Part Image 5CGXFC7D6F31I7 Intel Corporation

Field Programmable Gate Array, 5648 CLBs, 150000-Cell, CMOS, PBGA896

Part Image 5CGXFC7D6F31A7N Altera Corporation

Field Programmable Gate Array, PBGA896

Part Image 5CGXFC7D6F31C7N Altera Corporation

Field Programmable Gate Array, 5648 CLBs, 150000-Cell, CMOS, PBGA896

Part Image 5CGXFC7D6F31I7N Altera Corporation

Field Programmable Gate Array, 5648 CLBs, 150000-Cell, CMOS, PBGA896

Part Image 5CGXFC7D6F31A7 Intel Corporation

Field Programmable Gate Array, 5648 CLBs, PBGA896

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