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5CGXFC7D7F27C8N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone V GX 5648 LABs 336 IOs

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5CGXFC7D7F27C8N - Intel - PCB symbol
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PCB Footprints
5CGXFC7D7F27C8N - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA)
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5CGXFC7D7F27C8N - Intel - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA)
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5CGXFC7D7F27C8N Details

  • Manufacturer Part Number:

    5CGXFC7D7F27C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    336

  • Number of Logic Cells:

    149500

  • Number of Outputs:

    336

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    5648 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA672,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

5CGXFC7D7F27C8N Frequently Asked Questions (FAQs)

  • Intel recommends a 4-6 layer PCB stackup with a minimum of 2 mil trace width and 2 mil spacing. A dedicated ground plane and power plane are also recommended for optimal signal integrity.
  • Use the Intel Power Estimator tool to estimate power consumption based on your design's specific requirements. Optimize power consumption by using low-power modes, clock gating, and dynamic voltage and frequency scaling.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider using a fan. Keep the FPGA away from other heat sources and ensure good thermal conduction paths.
  • Use a reliable configuration device, such as a flash memory or a configuration FPGA. Ensure the configuration clock is stable and within the recommended frequency range.
  • Use differential signaling, keep clock lines short, and use shielding and grounding techniques to minimize EMI. Follow Intel's signal integrity guidelines and use simulation tools to validate your design.

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5CGXFC7D7F27C8N Overview

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