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5CSEBA5U23C6N - Intel

Description: FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9

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5CSEBA5U23C6N - Intel PCB footprint - BGA - BGA - 672-Pin-UBGA
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5CSEBA5U23C6N - Intel  - 3D model - BGA - 672-Pin-UBGA
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5CSEBA5U23C6N Details

  • Manufacturer Part Number:

    5CSEBA5U23C6N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    23 mm

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3207 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CSEBA5U23C6N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for Cyclone V SoC FPGAs, which includes recommendations for layer stackup, signal routing, and decoupling. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • To optimize power consumption, use the Intel PowerPlay Early Power Estimator (EPE) tool to estimate power consumption based on your design. Implement power-saving techniques like clock gating, dynamic voltage and frequency scaling, and use the lowest possible voltage and frequency for your application. For thermal management, ensure proper airflow, use thermal interfaces like heat sinks or thermal tapes, and monitor temperature using on-chip thermal sensors.
  • Implement a secure boot process using the FPGA's built-in security features, such as the Root of Trust (RoT) and the Secure Boot mechanism. Use encryption and authentication mechanisms, like AES and SHA, to protect your IP. Additionally, consider using Intel's FPGA-based security solutions, such as the Secure Device Manager (SDM) and the FPGA-based Root of Trust (FPGA-RoT).
  • Use the FPGA's built-in memory controllers and interfaces, such as DDR3/4, QSPI, and NAND, to optimize data transfer. Implement data buffering and caching mechanisms to reduce latency and increase bandwidth. Consider using Intel's FPGA-based memory solutions, such as the Hybrid Memory Cube (HMC) and the High-Bandwidth Memory (HBM), for high-performance applications.
  • Implement fault-tolerant design techniques, such as triple modular redundancy (TMR), error correction codes (ECC), and checksums, to detect and correct errors. Use the FPGA's built-in error detection and correction mechanisms, such as the Error Detection and Correction (EDC) feature. Consider using Intel's FPGA-based reliability solutions, such as the Fault-Tolerant (FT) and the Single Event Upset (SEU) mitigation features.

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