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5CSEMA5F31C7N - Intel

Description: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 85K Logic Elements 800MHz 896-FBGA (31x31)

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5CSEMA5F31C7N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CSEMA5F31C7N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CSEMA5F31C7N Details

  • Manufacturer Part Number:

    5CSEMA5F31C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B896

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    469

  • Number of Outputs:

    469

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3207 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5CSEMA5F31C7N Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for the 5CSEMA5F31C7N, which includes recommendations for PCB layout, thermal design, and power delivery. It's essential to follow these guidelines to ensure optimal performance, power efficiency, and thermal management.
  • Intel provides a Clock Tree Optimization Guide for the 5CSEMA5F31C7N, which offers guidance on clock tree architecture, clock domain crossing, and clock skew management. Additionally, Intel's Quartus Prime software provides tools and features to help optimize the clock tree.
  • Intel recommends using a power management strategy that includes voltage regulation, power gating, and dynamic voltage and frequency scaling. The 5CSEMA5F31C7N datasheet provides guidelines for power supply requirements, and Intel's Power Management Guide offers more detailed information on power management best practices.
  • To ensure signal integrity and minimize EMI, follow Intel's guidelines for signal routing, termination, and shielding. Use Intel's Signal Integrity Tool to analyze and optimize signal integrity. Additionally, follow best practices for PCB design, such as using differential pairs, minimizing trace lengths, and using EMI shielding.
  • The 5CSEMA5F31C7N has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement a thermal management strategy that includes heat sinks, thermal interfaces, and airflow management. Intel provides thermal management guidelines and recommends using thermal simulation tools to analyze and optimize thermal performance.

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5CSEMA5F31C7N Overview

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