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5CSEMA6U23A7N - Intel

Description: IC SOC CORTEX-A9 700MHZ 672UBGA

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PCB Footprints
5CSEMA6U23A7N - Intel PCB footprint - BGA - BGA - 5CSEBA5U23C7N
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3D Models
5CSEMA6U23A7N - Intel  - 3D model - BGA - 5CSEBA5U23C7N
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5CSEMA6U23A7N Details

  • Manufacturer Part Number:

    5CSEMA6U23A7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    23 mm

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4191 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CSEMA6U23A7N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the Cyclone V SoC family, which includes the 5CSEMA6U23A7N. The guide recommends a 4-6 layer PCB stackup with a minimum of two power planes and two ground planes. It also provides guidelines for signal routing, decoupling, and thermal management.
  • Intel provides a Power and Thermal Management Guide for the Cyclone V SoC family. It recommends using the PowerPlay power management technology, which allows for dynamic voltage and frequency scaling. Additionally, the guide provides thermal management guidelines, including heat sink selection and thermal interface material recommendations.
  • The hard IP blocks in the 5CSEMA6U23A7N have specific usage guidelines and limitations. For example, the PCIe interface has a maximum lane width of x4, and the DDR3 interface has a maximum frequency of 1600 MT/s. Additionally, there are specific timing and signal integrity requirements that must be met to ensure reliable operation.
  • Intel provides a Secure Boot and Firmware Authentication Guide for the Cyclone V SoC family. It recommends using the FPGA's built-in security features, such as the Root of Trust and the Secure Boot mechanism. Additionally, the guide provides guidelines for implementing firmware authentication and encryption using the FPGA's cryptographic engines.
  • Intel provides a range of development tools and software for the Cyclone V SoC family, including the Quartus II design software, the SoC Embedded Design Suite (EDS), and the FPGA SDK for OpenCL. Intel also offers a range of documentation, tutorials, and training resources to help get started with these tools.

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5CSEMA6U23A7N Overview

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