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5CSEMA6U23C6N - Intel

Description: FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9

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5CSEMA6U23C6N - Intel PCB footprint - BGA - BGA - 672-Pin UBGA - Wire Bond - A:1.85
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5CSEMA6U23C6N - Intel  - 3D model - BGA - 672-Pin UBGA - Wire Bond - A:1.85
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5CSEMA6U23C6N Details

  • Manufacturer Part Number:

    5CSEMA6U23C6N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    23 mm

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    4191 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CSEMA6U23C6N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the Cyclone V SoC family, which includes the 5CSEMA6U23C6N. The guide recommends a 4-6 layer stackup with a minimum of two power planes and two ground planes. It also provides guidelines for signal routing, decoupling, and thermal management.
  • Intel provides a Power and Thermal Management Guide for the Cyclone V SoC family. It recommends using the PowerPlay Early Power Estimator (EPE) tool to estimate power consumption and thermal design power (TDP). Additionally, the guide provides guidelines for power gating, clock gating, and dynamic voltage and frequency scaling (DVFS) to reduce power consumption.
  • The hard IP blocks in the 5CSEMA6U23C6N have specific usage guidelines and limitations. For example, the PCIe block has limitations on the number of lanes and speed, while the DDR3 block has restrictions on memory configuration and timing. Intel provides detailed documentation on the usage and limitations of each hard IP block in the Cyclone V SoC family.
  • Intel provides a Secure Boot and Firmware Integrity Guide for the Cyclone V SoC family. It recommends using the Boot Loader and Firmware Integrity features of the FPGA to ensure secure boot and firmware integrity. Additionally, the guide provides guidelines for implementing secure boot mechanisms, such as AES encryption and SHA-256 hashing.
  • Intel provides a range of development tools and software for designing and testing with the 5CSEMA6U23C6N, including the Quartus II Design Software, SoC Embedded Design Suite (EDS), and the FPGA SDK for OpenCL. Additionally, Intel offers a range of development boards and kits, such as the Cyclone V SoC Development Kit, to facilitate design and testing.

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5CSEMA6U23C6N Overview

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