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5CSXFC6C6U23I7N - Intel

Description: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SX FPGA - 110K Logic Elements 800MHz 672-UBGA (23x23)

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5CSXFC6C6U23I7N - Intel PCB footprint - BGA - BGA - 672-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.85
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5CSXFC6C6U23I7N - Intel  - 3D model - BGA - 672-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.85
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5CSXFC6C6U23I7N Details

  • Manufacturer Part Number:

    5CSXFC6C6U23I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    23 mm

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4191 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CSXFC6C6U23I7N Frequently Asked Questions (FAQs)

  • The maximum operating frequency depends on the specific configuration and implementation, but Intel FPGAs typically support frequencies up to 500 MHz or more.
  • To optimize power consumption, use Intel's PowerPlay Early Power Estimator (EPE) tool, implement power-gating, and optimize clock frequencies, among other techniques.
  • Use Intel's UniPHY IP core, which provides a pre-verified, high-performance DDR memory interface solution, and follow Intel's guidelines for DDR interface implementation.
  • Use Intel's Signal Integrity Tool (SIT) to analyze and optimize signal integrity, and follow best practices for PCB design, such as using differential pairs and minimizing signal lengths.
  • Use Intel's Quartus Prime Design Software, which provides a comprehensive design environment, including synthesis, placement, and routing tools, as well as simulation and verification capabilities.

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5CSXFC6C6U23I7N Overview

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