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5M160ZE64C4N - Intel

Description: CPLD - Complex Programmable Logic Devices

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5M160ZE64C4N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 64-Pin Plastic Enhanced Quad Flat (EQFP) - Wire Bond - A:1.20 - D2:4.5
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5M160ZE64C4N - Intel  - 3D model - Quad Flat Packages - 64-Pin Plastic Enhanced Quad Flat (EQFP) - Wire Bond - A:1.20 - D2:4.5
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for 5M160ZE64C4N
  • Part Number 5M160ZE64C4N
  • Manufacturer Intel
  • Pin Count 65
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - 64-Pin Plastic Enhanced Quad Flat (EQFP) - Wire Bond - A:1.20 - D2:4.5
  • Released Date Dec 14, 2023
  • Last Modified Date Dec 15, 2023 6:25 AM UTC
  • Pinout / Pin List Click Here (Member Only)

5M160ZE64C4N Details

  • Manufacturer Part Number:

    5M160ZE64C4N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    9 X 9 MM, 0.40 MM PITCH, LEAD FREE, PLASTIC, EQFP-64

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    184.1 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    7 mm

  • Number of I/O Lines:

    54

  • Number of Inputs:

    54

  • Number of Macro Cells:

    128

  • Number of Outputs:

    54

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Organization:

    0 DEDICATED INPUTS, 54 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Equivalence Code:

    TQFP64,.35SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    7.9 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

5M160ZE64C4N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 5M160ZE64C4N is -40°C to 100°C.
  • Clock signal routing for the 5M160ZE64C4N should be implemented using a dedicated clock tree, with a clock signal routed to each bank and a clock buffer for each bank.
  • The recommended power-up sequence for the 5M160ZE64C4N is to power up the core voltage (VCC) first, followed by the auxiliary voltage (VCCAUX) and then the input/output voltage (VCCIO).
  • Power-down sequencing for the 5M160ZE64C4N should be done in the reverse order of power-up, with VCCIO powered down first, followed by VCCAUX and then VCC.
  • PCB layout and routing for the 5M160ZE64C4N should follow guidelines for high-speed digital design, including using controlled impedance traces, minimizing signal skew, and avoiding signal routing near noise sources.

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