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5M570ZF256C4N - Intel

Description: IC CPLD 440MC 9NS 256FBGA

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5M570ZF256C4N - Intel PCB footprint - BGA - BGA - 256 pin FBGA-1
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5M570ZF256C4N - Intel  - 3D model - BGA - 256 pin FBGA-1
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5M570ZF256C4N Details

  • Manufacturer Part Number:

    5M570ZF256C4N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    184.1 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    17 mm

  • Number of I/O Lines:

    159

  • Number of Inputs:

    159

  • Number of Macro Cells:

    440

  • Number of Outputs:

    159

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    0 DEDICATED INPUTS, 159 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    9.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

5M570ZF256C4N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 5M570ZF256C4N is -40°C to 100°C.
  • To implement a CDC in the 5M570ZF256C4N, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated and synchronized.
  • The maximum frequency achievable with the 5M570ZF256C4N depends on the specific design and implementation, but it can reach up to 500 MHz or more with optimal placement and routing.
  • To optimize power consumption, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling, and take advantage of the FPGA's built-in power management features.
  • Yes, the 5M570ZF256C4N is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its robust design and manufacturing process.

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5M570ZF256C4N Overview

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Part Image 5M570ZF256C4 Intel Corporation

Flash PLD, 9.5ns, 440-Cell, CMOS, PBGA256