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5M570ZF256I5N - Intel

Description: CPLD MAX® V Family 440 Macro Cells 118.3MHz 1.8V 256-Pin FBGA Tray

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PCB Footprints
5M570ZF256I5N - Intel PCB footprint - BGA - BGA - 256 pin FBGA-1
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5M570ZF256I5N - Intel  - 3D model - BGA - 256 pin FBGA-1
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5M570ZF256I5N Details

  • Manufacturer Part Number:

    5M570ZF256I5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    118.3 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    17 mm

  • Number of I/O Lines:

    159

  • Number of Inputs:

    159

  • Number of Macro Cells:

    440

  • Number of Outputs:

    159

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    0 DEDICATED INPUTS, 159 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    17.7 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

5M570ZF256I5N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 5M570ZF256I5N is -40°C to 100°C.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal to the FPGA.
  • A good PCB layout and routing strategy for the 5M570ZF256I5N involves using a multi-layer PCB, separating analog and digital signals, and using differential pairs for high-speed signals. It's also recommended to follow Intel's PCB design guidelines and use a signal integrity analysis tool to optimize the design.
  • To optimize timing closure, use the Intel Quartus Prime software to analyze the design's timing requirements and optimize the placement and routing of the FPGA's resources. Additionally, use timing constraints to specify the required clock frequencies and data transfer rates.
  • The recommended decoupling capacitor values for the 5M570ZF256I5N are 0.1 μF and 10 μF, placed as close as possible to the FPGA's power pins. It's also recommended to use a decoupling capacitor network with a combination of ceramic and electrolytic capacitors to filter out noise and ripple.

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