9 X 9 MM, 0.40 MM PITCH, LEAD FREE, PLASTIC, EQFP-64
Country Of Origin:
Mainland China, Malaysia, Taiwan, USA, Vietnam
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Manufacturer:
Intel Corporation
YTEOL:
5
Additional Feature:
YES
Clock Frequency-Max:
118.3 MHz
In-System Programmable:
YES
JESD-30 Code:
S-PQFP-G64
JESD-609 Code:
e3
JTAG BST:
YES
Length:
7 mm
Moisture Sensitivity Level:
3
Number of I/O Lines:
54
Number of Inputs:
54
Number of Macro Cells:
64
Number of Outputs:
54
Number of Terminals:
64
Operating Temperature-Max:
85 °C
Organization:
0 DEDICATED INPUTS, 54 I/O
Output Function:
MACROCELL
Package Body Material:
PLASTIC/EPOXY
Package Code:
HTFQFP
Package Equivalence Code:
TQFP64,.35SQ,16
Package Shape:
SQUARE
Package Style:
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Programmable Logic Type:
FLASH PLD
Propagation Delay:
14 ns
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Supply Voltage-Max:
1.89 V
Supply Voltage-Min:
1.71 V
Supply Voltage-Nom:
1.8 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
OTHER
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
0.4 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
7 mm
5M80ZE64C5N Frequently Asked Questions (FAQs)
The recommended operating temperature range for the 5M80ZE64C5N is 0°C to 100°C (TJ). However, it's essential to note that the device can operate at a higher temperature range with reduced performance and lifespan.
To ensure signal integrity, it's crucial to follow the recommended PCB layout guidelines, use controlled impedance traces, and add signal termination resistors as specified in the datasheet. Additionally, consider using simulation tools to analyze and optimize the signal integrity of your design.
The maximum power consumption of the 5M80ZE64C5N varies depending on the operating frequency and voltage. To optimize power management, use the power management features built into the device, such as dynamic voltage and frequency scaling, and consider using power gating and clock gating techniques in your design.
To implement secure boot and firmware authentication, use the built-in security features of the 5M80ZE64C5N, such as the Secure Boot mechanism and the Firmware Authentication Unit. Additionally, consider using cryptographic algorithms and secure key storage to protect your firmware and data.
The recommended decoupling capacitor values and placement for the 5M80ZE64C5N are specified in the datasheet. In general, use a combination of high-frequency and low-frequency decoupling capacitors, and place them as close as possible to the power pins of the device.
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5M80ZE64C5N Overview
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