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5M80ZM68C5N - Intel

Description: CPLD - Complex Programmable Logic Devices CPLD - MAX V 64 Macro 52 IOs

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5M80ZM68C5N - Intel PCB footprint - BGA - BGA - 68-MBGA--
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5M80ZM68C5N - Intel  - 3D model - BGA - 68-MBGA--
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5M80ZM68C5N Details

  • Manufacturer Part Number:

    5M80ZM68C5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    5 X 5 MM, 0.50 MM PITCH, LEAD FREE, MBGA-68

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    118.3 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B68

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    5 mm

  • Number of I/O Lines:

    52

  • Number of Inputs:

    52

  • Number of Macro Cells:

    64

  • Number of Outputs:

    52

  • Number of Terminals:

    68

  • Operating Temperature-Max:

    85 °C

  • Organization:

    0 DEDICATED INPUTS, 52 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA68,9X9,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    14 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    5 mm

5M80ZM68C5N Frequently Asked Questions (FAQs)

  • Intel recommends a 4-layer PCB with a dedicated power plane, and a thermal design with a heat sink and thermal interface material to maintain a junction temperature below 100°C.
  • Use a signal integrity analysis tool to optimize trace lengths and routing, and implement EMI mitigation techniques such as shielding, grounding, and filtering.
  • The device requires a power-on sequence of VCCIO, VCC, and VCCA, with a voltage ramp-up time of 10 ms to ensure proper initialization and configuration.
  • Use the Intel Quartus Prime software to generate a programming file, and verify the configuration using the device's built-in self-test and diagnostic features.
  • The device meets Intel's quality and reliability standards, with a FIT rate of < 10. Ensure long-term reliability by following Intel's recommended design and manufacturing guidelines, and implementing a robust testing and validation process.

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5M80ZM68C5N Overview

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