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5PB1102CMGI - Renesas Electronics

Description: The 5PB1102 is a high-performance 1:2 LVCMOS clock buffer. It has best-in-class Additive Phase Jitter of 50fsec RMS. The 5PB1102 also supports an Output Enable function. It is available in 8-pin DFN and TSSOP packages and can operate from a 1.8V to 3.3V supply.

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PCB Footprints
5PB1102CMGI - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - 8PIN DFN+-+-
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3D Models
5PB1102CMGI - Renesas Electronics  - 3D model - Small Outline No-lead - 8PIN DFN+-+-
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5PB1102CMGI Details

  • Manufacturer Part Number:

    5PB1102CMGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    COL

  • Pin Count:

    8

  • Manufacturer Package Code:

    CMG8D1

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-10-01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 2.5 V AND 3.3 V POWER SUPPLY

  • Family:

    5PB11

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    S-XDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    13 mA

  • Prop. Delay@Nom-Sup:

    2.5 ns

  • Propagation Delay (tpd):

    2.9 ns

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

5PB1102CMGI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the package.
  • Implement a robust power-on reset circuit, ensure a stable clock source, and consider using a thermistor or thermocouple to monitor temperature. Also, follow the recommended operating conditions and derating guidelines.
  • Use a multi-layer PCB with a solid ground plane, keep signal traces short and away from the edge, and use shielding or a metal can to enclose the device. Also, ensure proper decoupling and filtering of power supplies.
  • Use the device's power-down modes, disable unused peripherals, and optimize clock frequencies. Also, consider using a low-dropout regulator (LDO) and a power-gating scheme.
  • Use a version control system, implement a modular code structure, and utilize the device's built-in debugging features, such as the on-chip debugger. Also, consider using a real-time operating system (RTOS) and a firmware development framework.

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5PB1102CMGI Overview

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