Description:The 5PB1102 is a high-performance 1:2 LVCMOS clock buffer. It has best-in-class Additive Phase Jitter of 50fsec RMS. The 5PB1102 also supports an Output Enable function. It is available in 8-pin DFN and TSSOP packages and can operate from a 1.8V to 3.3V supply.
IT CAN ALSO OPERATE WITH 2.5 V AND 3.3 V POWER SUPPLY
Family:
5PB11
Input Conditioning:
STANDARD
JESD-30 Code:
S-XDSO-N8
JESD-609 Code:
e4
Length:
2 mm
Logic IC Type:
LOW SKEW CLOCK DRIVER
Max I(ol):
0.012 A
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
8
Number of True Outputs:
2
Operating Temperature-Max:
105 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
UNSPECIFIED
Package Code:
VSON
Package Equivalence Code:
SOLCC8,.08,20
Package Shape:
SQUARE
Package Style:
SMALL OUTLINE, VERY THIN PROFILE
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Power Supply Current-Max (ICC):
13 mA
Prop. Delay@Nom-Sup:
2.5 ns
Propagation Delay (tpd):
2.9 ns
Same Edge Skew-Max (tskwd):
0.05 ns
Seated Height-Max:
0.8 mm
Supply Voltage-Max (Vsup):
3.465 V
Supply Voltage-Min (Vsup):
1.71 V
Supply Voltage-Nom (Vsup):
1.8 V
Surface Mount:
YES
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
2 mm
5PB1102CMGK Frequently Asked Questions (FAQs)
The recommended operating temperature range for the 5PB1102CMGK is -40°C to 125°C.
To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design guidelines, including providing adequate heat sinking and airflow, and ensuring that the device is operated within its specified temperature range.
Exceeding the maximum junction temperature (Tj) of the 5PB1102CMGK can lead to reduced reliability, increased power consumption, and potentially even device failure. It is essential to ensure that the device is operated within its specified temperature range to prevent overheating.
To handle electrostatic discharge (ESD) protection for the 5PB1102CMGK, it is recommended to follow proper ESD handling procedures, including using ESD-protective packaging, wrist straps, and mats, and ensuring that all equipment and tools are properly grounded.
When designing a PCB layout for the 5PB1102CMGK, it is essential to consider factors such as signal integrity, power distribution, and thermal management. This includes using proper decoupling, minimizing signal trace lengths, and ensuring adequate power and ground plane distribution.
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5PB1102CMGK Overview
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