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5PB1106PGGK - Renesas Electronics

Description: The 5PB1106 is a high-performance 1:6 LVCMOS clock buffer. It has best-in-class Additive Phase Jitter of 50 fsec RMS. The 5PB1106 also supports an Output Enable function. It is available in 16-pin QFN and 14-pin TSSOP packages and can operate from a 1.8 V to 3.3 V supply. 

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5PB1106PGGK - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG14T1
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5PB1106PGGK - Renesas Electronics  - 3D model - Small Outline Packages - PGG14T1
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5PB1106PGGK Details

  • Manufacturer Part Number:

    5PB1106PGGK

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    14

  • Manufacturer Package Code:

    PGG14T1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-10-01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 2.5 V AND 3.3 V POWER SUPPLY

  • Family:

    5PB11

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Number of True Outputs:

    6

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    30 mA

  • Prop. Delay@Nom-Sup:

    2.5 ns

  • Propagation Delay (tpd):

    3.3 ns

  • Same Edge Skew-Max (tskwd):

    0.058 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

5PB1106PGGK Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN4333EJ0100) which includes thermal design considerations, such as placing thermal vias under the package and using a solid ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement a robust thermal management system. Additionally, consider using a heat sink or a fan to reduce the junction temperature.
  • The input capacitor (CIN) should have a low ESR and be rated for the input voltage. A 10uF to 22uF ceramic capacitor is recommended. The output capacitor (COUT) should have a low ESR and be rated for the output voltage. A 10uF to 47uF ceramic capacitor is recommended. Refer to the datasheet for more detailed guidance.
  • To troubleshoot issues, start by verifying the input voltage, output voltage, and current. Check the PCB layout and thermal design for any potential issues. Use an oscilloscope to monitor the output voltage and current. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, to ensure EMI and EMC compliance, follow the recommended PCB layout and design guidelines, use a suitable EMI filter, and consider adding shielding or a metal can to the device. Additionally, ensure that the device is operated within the specified frequency range and that the output voltage is properly filtered.

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5PB1106PGGK Overview

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