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5PB1108PGGI - Renesas Electronics

Description: The 5PB1108 is a high-performance 1:8 LVCMOS clock buffer. It has best-in-class Additive Phase Jitter of 50 fsec RMS. The 5PB1108 also supports an Output Enable function. It is available in 16-pin QFN and TSSOP packages and can operate from a 1.8 V to 3.3 V supply. 

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5PB1108PGGI - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - tssop16-ren1
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5PB1108PGGI - Renesas Electronics  - 3D model - Small Outline Packages - tssop16-ren1
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5PB1108PGGI Details

  • Manufacturer Part Number:

    5PB1108PGGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    16

  • Manufacturer Package Code:

    PGG16

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-10-01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 2.5 V AND 3.3 V POWER SUPPLY

  • Family:

    5PB11

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    38 mA

  • Prop. Delay@Nom-Sup:

    2.5 ns

  • Propagation Delay (tpd):

    3.3 ns

  • Same Edge Skew-Max (tskwd):

    0.065 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

5PB1108PGGI Frequently Asked Questions (FAQs)

  • A thermal pad is recommended to be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal pad.
  • Follow the power-up sequence outlined in the datasheet, and ensure the EN pin is pulled high after the input voltage reaches the minimum operating voltage. Also, configure the device registers according to the application requirements.
  • Use a multi-layer PCB with a solid ground plane, and ensure the device is placed close to the power source. Use decoupling capacitors and ferrite beads to filter out high-frequency noise. Shielding and grounding of cables and connectors are also recommended.
  • Use a logic analyzer or oscilloscope to monitor the device's signals and registers. Check the device's status registers for error flags and fault indicators. Consult the datasheet and application notes for troubleshooting guidelines.
  • The device has a maximum junction temperature of 125°C. Ensure good airflow around the device, and consider using a heat sink or thermal interface material if the device is expected to operate in high-temperature environments.

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