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5PB1108PGGI8 - Renesas Electronics

Description: The 5PB1108 is a high-performance 1:8 LVCMOS clock buffer. It has best-in-class Additive Phase Jitter of 50 fsec RMS. The 5PB1108 also supports an Output Enable function. It is available in 16-pin QFN and TSSOP packages and can operate from a 1.8 V to 3.3 V supply. 

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PCB Footprints
5PB1108PGGI8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG16 (TSSOP16)-6
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5PB1108PGGI8 - Renesas Electronics  - 3D model - Small Outline Packages - PGG16 (TSSOP16)-6
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5PB1108PGGI8 Details

  • Manufacturer Part Number:

    5PB1108PGGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    16

  • Manufacturer Package Code:

    PGG16

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-10-01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 2.5 V AND 3.3 V POWER SUPPLY

  • Family:

    5PB11

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    38 mA

  • Prop. Delay@Nom-Sup:

    2.5 ns

  • Propagation Delay (tpd):

    3.3 ns

  • Same Edge Skew-Max (tskwd):

    0.065 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

5PB1108PGGI8 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the PMIC away from high-current paths and ensure good airflow around the device.
  • Use a power-on reset (POR) circuit to ensure the PMIC starts up correctly. For shutdown, use a soft-start circuit to prevent inrush currents and ensure a clean shutdown.
  • Use a common-mode choke, ferrite beads, and Y-capacitors to filter out EMI. Ensure proper PCB layout, grounding, and shielding to minimize radiation.
  • Use the PMIC's built-in power-saving features, such as dynamic voltage scaling and clock gating. Optimize the system's power domains and use low-power modes for peripherals and cores.
  • Use a thermal interface material (TIM) between the PMIC and heat sink. Ensure good airflow, and consider using a heat sink with a thermal conductivity of at least 1 W/m-K.

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5PB1108PGGI8 Overview

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