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5PB1110NDGI - Renesas Electronics

Description: The 5PB1110 is a high-performance 1:10 LVCMOS clock buffer. It has best-in-class Additive Phase Jitter of 50 fsec RMS. The 5PB1110 also supports an Output Enable function. It is available in 20-pin QFN and TSSOP packages and can operate from a 1.8 V to 3.3 V supply. 

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PCB Footprints
5PB1110NDGI - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NDG20P2
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5PB1110NDGI - Renesas Electronics  - 3D model - Quad Flat No-Lead - NDG20P2
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5PB1110NDGI Details

  • Manufacturer Part Number:

    5PB1110NDGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    20

  • Manufacturer Package Code:

    NDG20P2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-10-01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 2.5 V AND 3.3 V POWER SUPPLY

  • Family:

    5PB11

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    S-XQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.11SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    45 mA

  • Prop. Delay@Nom-Sup:

    2.5 ns

  • Propagation Delay (tpd):

    3 ns

  • Same Edge Skew-Max (tskwd):

    0.065 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

5PB1110NDGI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the package.
  • Implement a robust power-on reset circuit, ensure a stable clock signal, and consider using a thermistor or thermocouple to monitor temperature. Also, follow the recommended operating conditions and derating guidelines.
  • Use a combination of ceramic and electrolytic capacitors for decoupling, with a minimum of 10uF capacitance per power pin. Place decoupling capacitors as close to the power pins as possible, and use a star-configuration for bypassing.
  • Implement ESD protection diodes on all input/output pins, and consider using a TVS (Transient Voltage Suppressor) diode for additional protection. Ensure that the PCB layout and component selection meet the required ESD standards.
  • Use a high-quality clock source, ensure a low-jitter clock signal, and implement a clock buffer or repeater if necessary. Route clock signals as a differential pair, and avoid crossing clock signals over other signals or power planes.

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