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5PB1110NDGI8 - Renesas Electronics

Description: The 5PB1110 is a high-performance 1:10 LVCMOS clock buffer. It has best-in-class Additive Phase Jitter of 50 fsec RMS. The 5PB1110 also supports an Output Enable function. It is available in 20-pin QFN and TSSOP packages and can operate from a 1.8 V to 3.3 V supply. 

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PCB Footprints
5PB1110NDGI8 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 3 mm x 3 mm 20-pin TQFN
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3D Models
5PB1110NDGI8 - Renesas Electronics  - 3D model - Quad Flat No-Lead - 3 mm x 3 mm 20-pin TQFN
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5PB1110NDGI8 Details

  • Manufacturer Part Number:

    5PB1110NDGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    20

  • Manufacturer Package Code:

    NDG20P2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-10-01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 2.5 V AND 3.3 V POWER SUPPLY

  • Family:

    5PB11

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    S-XQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.11SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    45 mA

  • Prop. Delay@Nom-Sup:

    2.5 ns

  • Propagation Delay (tpd):

    3 ns

  • Same Edge Skew-Max (tskwd):

    0.065 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

5PB1110NDGI8 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current specifications. Implement proper thermal management, and consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • Critical timing parameters include clock frequency, setup and hold times, and signal rise and fall times. Ensure signal integrity by using controlled impedance traces, minimizing signal routing distances, and using signal termination resistors as needed.
  • Follow the recommended power-up and power-down sequences outlined in the datasheet. Ensure that the power supply voltage ramps up and down slowly (typically 1-10 ms) to prevent damage to the device.
  • Implement ESD protection measures such as using ESD-resistant devices, adding ESD protection diodes, and following proper handling and storage procedures to prevent damage from electrostatic discharge.

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