Description:The 5PB1110 is a high-performance 1:10 LVCMOS clock buffer. It has best-in-class Additive Phase Jitter of 50 fsec RMS. The 5PB1110 also supports an Output Enable function. It is available in 20-pin QFN and TSSOP packages and can operate from a 1.8 V to 3.3 V supply.
IT CAN ALSO OPERATE WITH 2.5 V AND 3.3 V POWER SUPPLY
Family:
5PB11
Input Conditioning:
STANDARD
JESD-30 Code:
S-XQCC-N20
JESD-609 Code:
e3
Length:
3 mm
Logic IC Type:
LOW SKEW CLOCK DRIVER
Max I(ol):
0.012 A
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
20
Number of True Outputs:
10
Operating Temperature-Max:
105 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
UNSPECIFIED
Package Code:
HVQCCN
Package Equivalence Code:
LCC20,.11SQ,16
Package Shape:
SQUARE
Package Style:
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Power Supply Current-Max (ICC):
45 mA
Prop. Delay@Nom-Sup:
2.5 ns
Propagation Delay (tpd):
3 ns
Same Edge Skew-Max (tskwd):
0.065 ns
Seated Height-Max:
1 mm
Supply Voltage-Max (Vsup):
3.465 V
Supply Voltage-Min (Vsup):
1.71 V
Supply Voltage-Nom (Vsup):
1.8 V
Surface Mount:
YES
Terminal Finish:
Tin (Sn)
Terminal Form:
NO LEAD
Terminal Pitch:
0.4 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
3 mm
5PB1110NDGK8 Frequently Asked Questions (FAQs)
Renesas provides a recommended PCB layout guide in their application note (AP61101) for the 5PB1110NDGK8, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
Renesas recommends using an external overcurrent protection circuit, such as a fuse or a dedicated overcurrent protection IC, to prevent damage to the device in case of an overcurrent event. The datasheet provides guidelines for selecting the appropriate overcurrent protection component.
While the datasheet specifies an operating temperature range of -40°C to 125°C, Renesas recommends derating the device's performance at temperatures above 105°C to ensure reliable operation and prevent thermal-related failures.
Renesas provides guidelines for EMC design considerations in their application note (AP61102), including recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference and ensure compliance with relevant EMC standards.
Renesas recommends a specific power-up sequence to ensure proper device initialization and prevent latch-up or other issues. The recommended sequence is: VCC, then VDD, and finally the input signals.
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5PB1110NDGK8 Overview
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