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6116LA120DB - Renesas Electronics

Description: The 6116 5V CMOS SRAM is organized as 2K x 8. The 6116 offers a reduced power standby mode.The low-power (LA) version also offers a battery backup data retention capability where the circuit typically consumes only 1μW to 4μW operating off a 2V battery. All inputs and outputs are TTL-compatible. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. Military grade product is available.

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6116LA120DB - Renesas Electronics - PCB symbol
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PCB Footprints
6116LA120DB - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - PDIP-24
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6116LA120DB - Renesas Electronics - 3D model - Dual-In-Line Packages - PDIP-24
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6116LA120DB Details

  • Manufacturer Part Number:

    6116LA120DB

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CDIP

  • Package Description:

    DIP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    CD24

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.32.00.41

  • Date Of Intro:

    2020-07-21

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    120 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-CDIP-T24

  • JESD-609 Code:

    e0

  • Length:

    32 mm

  • Memory Density:

    16384 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    24

  • Number of Words:

    2048 words

  • Number of Words Code:

    2000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    2KX8

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP24,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    240

  • Screening Level:

    MIL-STD-883 Class B

  • Seated Height-Max:

    2.9 mm

  • Standby Current-Max:

    0.015 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

6116LA120DB Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation across the entire operating temperature range, it's essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
  • Exceeding the maximum junction temperature can lead to reduced reliability, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain its performance and lifespan.
  • To handle ESD protection, follow proper handling and storage procedures, such as using anti-static bags or wrist straps. On the PCB, consider adding ESD protection devices, such as TVS diodes or ESD arrays, to protect the device from electrostatic discharge.
  • The recommended soldering conditions for the 6116LA120DB include a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering method that minimizes thermal stress, such as reflow soldering or wave soldering.

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6116LA120DB Overview

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6116LA120DB Alternates

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Image Part Number Model
Part Image IDT6116LA120DB Renesas Electronics Corporation

Standard SRAM, 2KX8, 120ns, CMOS, CDIP24
Part Image AM9128-12/BJC AMD

Standard SRAM, 2KX8, 120ns, NMOS, CDIP24
Part Image 6116LA120DI Integrated Device Technology Inc

Standard SRAM, 2KX8, 120ns, CMOS, CDIP24
Part Image IDT6116SA120DI Integrated Device Technology Inc

Standard SRAM, 2KX8, 120ns, CMOS, CDIP24
Part Image IDT6116SA120DM Integrated Device Technology Inc

Standard SRAM, 2KX8, 120ns, CMOS, CDIP24
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