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6116LA25SOGI - Renesas Electronics

Description: The 6116 5V CMOS SRAM is organized as 2K x 8. The 6116 offers a reduced power standby mode.The low-power (LA) version also offers a battery backup data retention capability where the circuit typically consumes only 1μW to 4μW operating off a 2V battery. All inputs and outputs are TTL-compatible. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. Military grade product is available.

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6116LA25SOGI - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PSG24
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6116LA25SOGI Details

  • Manufacturer Part Number:

    6116LA25SOGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    PSG24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2020-07-21

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    25 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    15.4 mm

  • Memory Density:

    16384 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    24

  • Number of Words:

    2048 words

  • Number of Words Code:

    2000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2KX8

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.34 mm

  • Standby Current-Max:

    0.035 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.11 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.6 mm

6116LA25SOGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-1201) for the 6116LA series, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • Renesas recommends following the IEC 62368-1 standard for EMC compliance. Additionally, they provide guidelines for PCB layout, component selection, and shielding in their application note (APL-AN-1202) to minimize electromagnetic interference (EMI) and ensure compliance.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, Renesas recommends derating the device's power dissipation above 85°C to ensure reliable operation and prevent thermal runaway.
  • Renesas recommends using an external overvoltage protection (OVP) circuit, such as a voltage supervisor or a dedicated OVP IC, to protect the 6116LA25SOGI from voltage transients and surges. The OVP circuit should be designed to trigger at a voltage slightly above the device's maximum rated voltage.
  • Renesas recommends following the JEDEC J-STD-020D.1 standard for soldering profiles, which specifies a peak temperature of 260°C and a dwell time of 30 seconds. It's essential to follow this profile to prevent damage to the device during the soldering process.

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6116LA25SOGI Overview

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